MTFA500 Epoxy Resin Adhesive Film for Prepregs, 1250mm

MTFA500 (DF044) Adhesive Film  
MTFA500 (DF044) adhesive resin film is designed to cure between 80 and 120°C, allowing flexibility in component manufacture.   

Key Features  

• Cure temperature 80°C to 120°C.
• Service temperatures up to 120°C after postcure.
• Low CTE and shrinkage.
• Work life at 20°C: 28 days.
• Storage life at -18°C: 12 months.
• Very low VOC content – no added solvents during manufacture.  

Recommended Cure cycles  

Initial cure 80°C at a ramp rate of up to 2°C and maintain for 16 hours under vacuum.

Post cure (where required for high Tg) 1 hour dwell at 120°C – maximum ramp rate of 20°C per hour.

Alternative Cure Cycles and Resulting Tg: please see Technical Data Sheet available.

Type of supply

MTFA500 (DF044)-150gsm-PC13-1250 x 1 m2, supplied rolled in cardboard box

MTFA500 (DF044)-150gsm-PC13-1250 x 5 m2, supplied rolled in cardboard box

MTFA500 (DF044)-150gsm-PC13-1250 x 25 m2, supplied rolled in cardboard box