Tax incl. Tax excl.

Parts and encapsulation / Flexible epoxy

Electronic component encapsulation

Encapsulating electronic components requires a system compatible with the device, working temperature, curing stresses and service conditions. Selection must be supported by the technical data sheet and validated for the specific application.

View selected materials ↓
Electronic component encapsulation

Before you buy

Three points to guide your choice

01

The component being encapsulated

Define the electronic component, housing and areas that must remain exposed for it to function.

02

System behaviour

Check adhesion, flexibility, temperature and compatibility with the device's materials.

03

Electrical and functional validation

A reference to sensors is not dielectric certification for any circuit. Validate the complete assembly before production.

What to buy for this project

Selected materials

Compare their purpose and conditions of use.
Check sizes and options on each product page.

Resoltech 1600 Flexible Epoxy Resin

Flexible 1600 / 1606 system

Resoltech 1600 Flexible Epoxy Resin

Flexible 1600/1606 system for encapsulating sensors.

Before choosing

Validate the electrical, thermal and functional requirements of the component being encapsulated. The documented use is sensor encapsulation; for other electronic devices, confirm suitability before manufacturing.

View product and optionsTechnical data sheet · pp. 2, 3 ↗

You may also be interested in

All applications →

Does your project have other requirements?

Tell us about the process, materials and working conditions.

Discuss my project
Product added to wishlist
WhatsApp
Product added to comparison.